Fabrication and Characterization of piezoelectric thick films prepared by Screen Printing Method

Screen Printing법을 이용한 압전 후막의 제조 및 특성연구

  • 김상종 (경원대학교 전기전자공학과) ;
  • 최형욱 (경원대학교 전기전자공학과) ;
  • 백동수 (한국요업기술원) ;
  • 최지원 (한국과학기술연구원 박막기술센터) ;
  • 윤석진 (한국과학기술연구원 박막기술센터) ;
  • 김현재 (한국과학기술연구원 박막기술센터)
  • Published : 2000.07.01

Abstract

Characteristics of piezoelectric thick films prepared by screen printing method were investigated. The piezoelectric thick films were printed using Pb(Mg,Nb)O$_3$-Pb(Zr,Ti)O$_3$system. The lower electrodes were coated with various thickness of Ag-Pd by screen printing to investigate the effect as a diffusion barrier and deposited with Pt by sputtering on Ag-Pd. The ceramic paste was prepared by mixing powder and binder with various ratios using three roll miller. The fabricated thick films were burned out at 650$^{\circ}C$ and sintered at 950$^{\circ}C$ in the O$_2$condition for each 20, 60min after printing with 350mesh screen. The thickness of piezoelectric thick film was 15∼20 $\mu\textrm{m}$ and the Ag-Pd electrode acted as a diffusion barrier above 3 $\mu\textrm{m}$ thickness. When the lower electrode Ag-Pd was 6 $\mu\textrm{m}$ and the piezoelectric thick films were sintered by 2nd step (650$^{\circ}C$/20min and 950$^{\circ}C$/1h) using paste mixed Pb(Mg,Nb)O$_3$-Pb(Zr,Ti)O$_3$$.$ MnO$_2$+ Bi$_2$O$_3$. V$_2$O$\_$5/ and binder in the ratio of 70:30, the remnant polarization of thick film was 9.1 ${\mu}$C /cm$^2$.

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