Thermomechanical Analysis of Functionally Gradient Al-$SiC_{p}$ Composite for Electronic Packaging

전자패키지용 경사조성 Al-$SiC_{p}$ 복합재료의 열 . 기계적 변형특성 해석

  • 송대현 (부산대학교 공과대학 금속공학과) ;
  • 최낙봉 (부산대학교 공과대학 금속공학과) ;
  • 김애정 (부산대학교 공과대학 금속공학과) ;
  • 조경목 (항공재료연구센터 (CAAM)) ;
  • 박익민 (부산대학교 공과대학 금속공학과)
  • Published : 2000.04.01

Abstract

The internal residual stresses within the multilayered structure with shan interface induced by the difference in thermal expansion coefficient between the materials of adjacent layers often provide the source of failure such as delamination of interfaces and etc. Recent development of the multilayered structure with functionally graded interface would be the solution to prevent this kind of failure. However a systematic thermo-mechanical analysis is needed fur the customized structural design of multilayered structure. In this study, theoretical model for the thermo-mechanical analysis is developed for multilayered structures of the Al-$SiC_p$ functionally graded composite for electronic packaging. The evolution of curvature and internal stresses in response to temperature variations is presented for the different combinations of geometry. The resultant analytical solutions are used for the optimal design of the multilayered structures with functionally graded interface as well as with sharp interface.