반도체 heatsink용 고부피분율 SiCp/Al 금속복합재료의 제조공정 및 열적특성분석

Fabrication Process and Analysis of Thermal Properties of High Volume Fraction SiCpi/Al Metal Matrix Composites for Heatsink Materials

  • 이효수 (한국과학기술원 재료공학과) ;
  • 홍순형 (한국과학기술원 재료공학과)
  • 발행 : 2000.11.01

초록

The fabrication process and analysis of thermal properties of 50~76vo1% SiCp/Al metal matrix composites(MMCs) for heatsink materials in electronic packaging were investigated. The 50~76vo1% SiCp/Al MMCs fabricated by pressure infiltration casting process showed that thermal conductivities were 85~170W/mK and coefficient of thermal expansion(CTE) were ranged 10~6ppm1k. Specially, the thermal conductivity and CTE of 71vo1%SiCp/Al MMCs were ranged 115~156W/mK and 6~7ppm/K. respectively, which showed a improved thermal properties than the conventional electronic packaging materials such as ceramics and metals.