# 전자 패키징용 직조형 금속복합재료 개발

• 이상관 (한국기계연구원 재료공정 연구부) ;
• 김진봉 (한국기계연구원 재료공정 연구부) ;
• 홍순형 (KAIST 재료공학과)
• Published : 2000.11.01

#### Abstract

A new textile metal matrix composite fur electronic packaging was developed and characterized. The thermal management materials consist of a plain woven carbon fabric as reinforcement and pure aluminum as matrix. The finite element method has been utilized in the analysis of thermal stress between the constituent components of packaging. The prototype part was manufactured by the liquid pressurizing method. The composite has CTE values of 4 to $5{\times}10^{-6}\;^{\circ}C^{-1}$10 in the range of $25^{\circ}C$ ~ 175$^{\circ}C$, resulting in good agreement with electronic materials such as Si and GaAs.