A Study on Thermomechanical Analysis of Laser Ablation on Cr thin film

크롬박막의 레이저 어블레이션에서 열적.기계적 해석에 관한 연구

Single-shot laser damage of thin Cr films on glass substrates has been studied to understand the cracking and peeling-off mechanism. A numerical model is developed for the calculation of transient heat transfer and thermal stresses in Cr films during excimer laser irradiation and cooling, the transient temperature, and the stress-strain fields are analyzed by using a three-dimensional finite-element model of heat flow. According to the numerical analysis for the experimentally determined cracking and peeling-off conditions, cracking is found to be the result of the tensile brittle fracture due to the excessive thermal stresses formed during the cooling process, while peeling-off is found to be the combined result of films bulging from the softened glass surface at higher temperature and the tensile brittle fracture during the cooling process.