Fabrication of Tantalum Nitride Thin-Film as High-temperature Strain Gauges

고온 스트레인 게이지용 질화탄탈박막의 제작

  • 김재민 (동서대학교 정보시스템공학부 메카트로닉스) ;
  • 최성규 (영남대학교 전자공학과) ;
  • 남효덕 (영남대학교 전자공학과) ;
  • 정귀상 (동서대학교 정보시스템공학부 메카트로닉스)
  • Published : 2001.11.01

Abstract

This paper presents the characteristics of Ta-N thin-film strain gauges as high-temperature strain gauges, which were deposited on Si substrate by DC reactive magnetron sputtering in an argon-nitrogen atmosphere(Ar-(4∼16 %)N$_2$). These films were annealed for 1 hour in 2x10$\^$-6/ Torr vaccum furnace range 500∼1000$^{\circ}C$. The optimized conditions of Ta-N thin-film strain gauges were annealing condition(900$^{\circ}C$, 1 hr.) in 8% N$_2$ gas flow ratio deposition atmosphere. Under optimum conditions, the Ta-N thin-films for strain gauges is obtained a high resistivity, $\rho$=768.93 ${\mu}$Ω cm, a low temperature coefficient of resistance, TCR=-84 ppm/$^{\circ}C$ and a high temporal stability with a good longitudinal gauge factor, GF=4.12.

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