Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)

2001.07a
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Pages.134-141
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2001

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)

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Effects of Cu or Bi Additions on the Creep Properties of the Sn-3.5Ag Solder Alloys

Shin, S.W. (Center for Electronic Packaging Materials Department of Mater, Sci. & Eng. KAIST) ;
Joo, D.K. (Center for Electronic Packaging Materials Department of Mater, Sci. & Eng. KAIST) ;
Yu, Jin (Center for Electronic Packaging Materials Department of Mater, Sci. & Eng. KAIST)

Published : 2001.07.01

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