Proceedings of the KIEE Conference (대한전기학회:학술대회논문집)

The Korean Institute of Electrical Engineers (대한전기학회)
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Fabrication of $100{\mu}m$ thick mold and electroplating using thick photoresist

후막 감광제를 이용한 $100{\mu}m$ 두께 몰드 제작과 전해도금

  • Jung, Hyoung-Kyoon (School of Electrical Engineering and Computer Science, Seoul National University) ;
  • Ahn, Si-Hong (School of Electrical Engineering and Computer Science, Seoul National University) ;
  • Kim, Yong-Kweon (School of Electrical Engineering and Computer Science, Seoul National University)
  • 정형균 (서울대학교 전기.컴퓨터공학부) ;
  • 안시홍 (서울대학교 전기.컴퓨터공학부) ;
  • 김용권 (서울대학교 전기.컴퓨터공학부)
  • Published : 2002.07.10
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Abstract

Process conditions of a novel negative thick photoresist, JSR THB-$430N^{(R)}$, are established in this paper. Although SU-8 obtains uniform and high-aspect-ratio structures, it is hard to remove the SU-8 mold after electroplating. The JSR THB-$430N^{(R)}$ can be more easily removed than the SU-8 and has a low internal stress. Introducing two step strip processes using acetone and the jSR THB-$S1^{(R)}$, the JSR THB-$430N^{(R)}$ electroplating mold was removed completely and a JSR THB-$430N^{(R)}$ film stress is compressive less than 2 MPa. In this paper, we obatined $200{\mu}m$ thick PR structure and $100{\mu}m$ thick electroplated nickel structure using the JSR THB-$430N^{(R)}$ photoresist.

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