DISTRIBUTIONS OF RESIDUAL STRESSES IN DIFFUSION BONDING OF DISSIMILAR MATERIALS TIAL TO STEEL 40CR

  • Peng, He (National Key Laboratory of Advanced Welding Production Technology) ;
  • Jicai, Feng (National Key Laboratory of Advanced Welding Production Technology) ;
  • Yiyu, Qian (National Key Laboratory of Advanced Welding Production Technology) ;
  • Jiecai, Han (National Key Laboratory of Advanced Welding Production Technology)
  • Published : 2002.10.01

Abstract

Distributions of residual stress in diffusion bonding of dissimilar materials intermetallics TiAl to steel 40Cr were simulated by FEM calculation. Results showed that destructive residual stresses presented in the minute area adjacent to bond-line of the base material with smaller coefficient of thermal expansion. Reducing bonding temperature and diminishing bonding time are in favor of the mollification of interface tresses.

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