Analysis of Thermal Stresses Induced in Polymeric Thin Layer Due to Temperature Change

온도변화로 인해 고분자 박막에 발생하는 열응력 해석

In this study, the singular thermal stresses induced during cooling down from high temperature to room temperature have been analyzed for the viscoelastic thin layer. The time domain boundary element method has been employed to investigate the behavor of stresses for the whole interface. Within the context of a linear viscoelastic theory, a stress singularity exists at the point where the interface between the elastic substrate and the viscoelastic thin layer intersects the free surface.