Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2002.11a
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- Pages.147-150
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- 2002
A Study of DHF application at W CMP Cleaning Process
W CMP 세정 공정에서 DHF에 적용에 관한 연구
- Kim, Sang-Yong (ANAM Semiconducter) ;
- Seo, Yong-Jin (Deabul University) ;
- Lee, Woo-Sun (Chosun University) ;
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Kim, Chang-Il
(Chungang University)
;
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Chang, Eui-Goo
(Chungang University)
- Published : 2002.11.07
Abstract
In this study, we evaluated the dilute HF Cleaning to reduce residual defects made by W CMP process. But, One point we should focus is It should not effect to metal thin film reliability. The purpose of this test is to verify barrier metal damage during HF cleaning and based on this result we get rid of slurry residue defect which is main defect of W CMP process for the better yield.