한국마이크로전자및패키징학회:학술대회논문집 (Proceedings of the International Microelectronics And Packaging Society Conference)

한국마이크로전자및패키징학회 (The Korean Microelectronics and Packaging Society)
권호 표지

EMC 특성이 Package warpage 거동에 미치는 영향

Effect of EMC Characteristics on Package Warpage Behavior

  • SONG Jae-kyu (Material & Process Development Team, R&D center, Amkor Technology Korea, Inc.) ;
  • YOO Min (Material & Process Development Team, R&D center, Amkor Technology Korea, Inc.) ;
  • YOO HeeYeoul (Material & Process Development Team, R&D center, Amkor Technology Korea, Inc.)
  • 발행 : 2003.11.01
PDF 다운로드
⟨ 이전 논문 다음 논문 ⟩

초록

키워드