모아레 간섭계를 이용한 BGA 패키지의 비선형 열변형 해석

Non-linear Temperature Dependent Deformation Analysis of BGA Package Using Moire Interferometry

Thermo-mechanical behavior of a ceramic ball grid array(CBGA) package assembly and wire bond ball grid array(WB-PBGA) package assemblies are characterized by high sensitive moire interferometry. Moire fringe patterns are recorded and analyzed at various temperatures in a temperature cycle. Thermal-history dependent analyses of global and local deformations are presented, and bending deformation(warpage) of the package and shear strain in the rightmost solder ball are discussed. A significant non-linear global behavior is documented due to stress relaxation at high temperature. The locations of the critical solder ball in WB-PBGA package assemblies are documented.