Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
권호 표지

Growth Behavior of Intermetallic Compounds in Sn-Ag-Bi/Cu Solder Joints during Aging

Sn-Ag-Bi/Cu 솔더 조인트의 aging시 금속간화합물 성장 거동

  • 한상욱 (삼성전자 DS Network 총괄 IPT 개발) ;
  • 박창용 (삼성전자 DS Network 총괄 DP 센타) ;
  • 허주열 (고려대학교 재료공학부)
  • Published : 2003.11.01
Download PDF
⟨ Previous Next ⟩

Abstract

The effect of Bi additions to the eutectic Sn-3.5Ag solder alloy on the growth kinetics of the intermetallic compound (IMC) layers during solid-state aging of Sn-Ag-Bi/Cu solder joints has been Investigated. The Bi additions enhanced the growth rate of the total IMC layer comprising of $Cu_6Sn_5$ and $Cu_3Sn$ sublayers. This enhanced IMC growth rate was primarily due to the rapid increase In the growth rate of $Cu_6Sn_5$ sublayer. The growth rate of $Cu_3Sn$ sublayers was little influenced and appeared to be retarded by the Bi additions. The observed growth behavior of $Cu_6Sn_5$ and $Cu_3Sn$ sublayers could be understood if the interfacial reaction barrier at the $Cu_6Sn_5/solder$ interface were reduced by the segregation of Bi at the interface.

Keywords