한국마이크로전자및패키징학회:학술대회논문집 (Proceedings of the International Microelectronics And Packaging Society Conference)

한국마이크로전자및패키징학회 (The Korean Microelectronics and Packaging Society)
권호 표지

광모듈 패키지용 Window 의 Metallization Pattern 제작 및 특성 평가

Fabrication and Characterization of Window Metallization Pattern for Optical Module Package

  • 조현민 (전자부품연구원 고주파재료연구센터) ;
  • 단성백 (주) 쎄라닉스) ;
  • 류헌위 (주)래피더스) ;
  • 강남기 (전자부품연구원 고주파재료연구센터)
  • 발행 : 2003.11.01
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초록

Optical module package is a hermetic metal-ceramic package for carrying optical IC. In case of LD(laser diode) module, window is used for both the path of optical signal and hermetic sealing of package. So, window has the metallization pattern on the surface for brazing process with package wall. In this study, several method were investigated for metallization. Thin film, thick film and mixed method were used for fabrication of metallization pattern. After brazing process, hermeticity and adhesion strength were tested for characterization of metallization pattern.

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