한국정보디스플레이학회:학술대회논문집

The Korean Infomation Display Society (한국정보디스플레이학회)
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A New COG Technique Using Solder Bumps for Flat Panel Display

  • Lee, Min-Seok (Div. of Materials Science and Engineering, Hanyang University) ;
  • Kang, Un-Byoung (Div. of Materials Science and Engineering, Hanyang University) ;
  • Kim, Young-Ho (Div. of Materials Science and Engineering, Hanyang University)
  • Published : 2003.07.09
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Abstract

We report a new FCOG (flip chip on glass) technique using solder bumps for display packaging applications. The In and Sn solder bumps of 40 ${\mu}m$ pitches were formed on Si and glass substrate. The In and Sn bumps were bonded at 125 at the pressure of 3 mN/bump. The metallurgical bonding was confirmed using cross-sectional SEM. The contact resistance of the solder joint was 65 $m{\Omega}$ which was much lower than that of the joint made using the conventional ACF bonding technique. We demonstrate that the new COG technique using solder bump to bump direct bonding can be applied to advanced LCDs that lead to require higher quality, better resolution, and lower power consumption.

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