Proceedings of the KWS Conference (대한용접접합학회:학술대회논문집)

The Korean Welding and Joining Society (대한용접접합학회)
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Microstructure and Mechanical Property of In48wt％Sn Solder / Electrolytic Au/Ni/Cu BGA Substrate with Multiple Reflows

리플로우에 따른 In-48Sn 솔더와 전해 Au/Ni/Cu BGA 기판의 미세구조와 기계적 특성

  • 구자명 (성균관대학교 신소재공학과) ;
  • 김대곤 (성균관대학교 신소재공학) ;
  • 정승부 (성균관대학교 신소재공학과)
  • Published : 2004.05.01
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Abstract

Microstructure and mechanical property of In48Sn solder on electrolytic Au/Ni/Cu BGA substrate were investigated with the number of reflows. AuIn and AuIn$_2$ IMCs were formed at the interface solder and pad after 1reflow. An increase of the number of reflows changed AuIn into AuIn$_2$. AuIn$_2$ IMC layer at the interface broke and spalled away into the solder after 3reflows. Shear force decreased with the number of reflows because the weakness of the interface by the spalling of AuIn$_2$ IMC layer.

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