Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2004.07b
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- Pages.1288-1291
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- 2004
Characteristics by Surfactant Condition at Copper CMP
구리 CMP시 비이온 계면활성제의 알루리마 슬러리 안정성에 대한 효과
- Lee, Do-Won (Chung-Ang University) ;
- Kim, Nam-Hoon (Chung-Ang University) ;
- Kim, Sang-Yong (Dongbu-Anam Semiconductor) ;
- Seo, Yong-Jin (Daebul University) ;
- Chang, Eui-Goo (Chung-Ang University)
- Published : 2004.07.05
Abstract
In this study, physical characteristics of alumina slurry on variation of pH value and the effect of non-ionic surfactants on alumina slurry for copper chemical mechanical planarization (CMP) slurry have been investigated. After pH value of the slurry with alumina abrasive was changed by adding various amount of
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