Low temperature pulsed ion shower doping for poly-Si TFT on plastic

  • Kim, Jong-Man (Dept. of Electronics Engineering, Sejong University) ;
  • Hong, Wan-Shick (Dept. of Electronics Engineering, Sejong University) ;
  • Kim, Do-Young (Samsung Advanced institute of Technology (SAIT)) ;
  • Jung, Ji-Sim (Samsung Advanced institute of Technology (SAIT)) ;
  • Kwon, Jang-Yeon (Samsung Advanced institute of Technology (SAIT)) ;
  • Noguchi, Takashi (Samsung Advanced institute of Technology (SAIT), SungKyunkwan University)
  • Published : 2004.08.23

Abstract

We studied a low temperature ion doping process for poly-Si Thin Film Transistor (TFT) on plastic substrates. The ion doping process was performed using an ion shower system, and subsequently, excimer laser annealing (ELA) was done for the activation. We have studied the crystallinity of Si surface at each step using UV-reflectance spectroscopy and the sheet resistance using 4-point probe. We found that the temperature has increased during ion shower doping for a-Si film and the activation has not been fulfilled stably because of the thermal damage against the plastic substrate. By trying newly a pulsed ion shower doping, the ion was efficiently incorporated into the a-Si film on plastic substrate. The sheet resistance decreased with the increase of the pulsed doping time, which was corresponded to the incorporated dose. Also we confirmed a relationship between the crystallinity and the sheet resistance. A sheet resistance of 300 ${\Omega}$/sq for the Si film of 50nm thickness was obtained with a good reproducibility. The ion shower technique is a promising doping technique for ultra low temperature poly-Si TFTs on plastic substrates as well as those on glass substrates.

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