Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2004.04b
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- Pages.38-41
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- 2004
Titration methods of $H_2O_2$ in Cu/TaN CMP
Cu/TaN CMP시 $H_2O_2$ 적정방법
- Yoo, Hae-Young (Chung-Ang University) ;
- Kim, Nam-Hoon (Chung-Ang University) ;
- Kim, Sang-Yong (DongbuAnam Semiconductor) ;
- Kim, Tae-Hyung (Yeojoo Institute of Technology) ;
- Chang, Eui-Goo (Chung-Ang University)
- Published : 2004.04.24
Abstract
The oxidizer plays an important role in the metal chemical mechanical polishing(CMP) slurry. Currently, the oxidizer used in CMP slurry is nearly divided into several kinds such as