한국전기전자재료학회:학술대회논문집 (Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference)
- 한국전기전자재료학회 2004년도 춘계학술대회 논문집 반도체 재료 센서 박막재료 전자세라믹스
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- Pages.38-41
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- 2004
Cu/TaN CMP시 $H_2O_2$ 적정방법
Titration methods of $H_2O_2$ in Cu/TaN CMP
- Yoo, Hae-Young (Chung-Ang University) ;
- Kim, Nam-Hoon (Chung-Ang University) ;
- Kim, Sang-Yong (DongbuAnam Semiconductor) ;
- Kim, Tae-Hyung (Yeojoo Institute of Technology) ;
- Chang, Eui-Goo (Chung-Ang University)
- 발행 : 2004.04.24
초록
The oxidizer plays an important role in the metal chemical mechanical polishing(CMP) slurry. Currently, the oxidizer used in CMP slurry is nearly divided into several kinds such as