Analysis on the Effect of Operating Conditions on the Thermal Response of Electronic Assemblies during Infrared Reflow Soldering

적외선 리플로 솔더링시 작동조건이 전자조립품의 열적반응에 미치는 영향 분석

A numerical study is performed to predict the effect of operating conditions on the thermal response of electronic assemblies during infrared reflow soldering. The multimode heat transfer within the reflow oven as well as within the electronic assembly is simulated, and the predictions illustrate the detailed thermal responses. Parametric study is performed to determine the thermal response of electronic assemblies to various conditions such as conveyor speed, exhaust velocity, and component emissivity. The predictions of the detailed electronic assembly thermal response can be used in selecting the oven operating conditions to ensure proper soldering and minimization of thermally-induced electronic assembly stresses.