Cooling Technique for Electronic Equipments using a small scale CPL heat pipe

소형 CPL 히트파이프를 이용한 전자장치 냉각 기술

The heat flux on a chip is rapidly increasing with decreasing the size of one. It is necessary to properly cool the high heat flux chip. One of the promising cooling methods is to apply CPL heat pipes with porous materials, for example PVA, polyethylene, and powder sintered metal plate and with microchannels in the evaporator. A small scale CPL heat pipe with PVA as wick was designed and manufactured. Since the height difference between the evaporator and the condenser is a crucial parameter in the CPL heat pipes, the performance of the heat pipes depending on the parameter was investigated. The parameter is higher the performance is better. However, the improvement rate of the performance does not increase the increase rate of the height. In addition to, the parameter effect depending on heat input was investigated.