Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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A Study on STI CMP Characteristics using Microstructure Pad

마이크로 표면 구조물을 갖는 패드의 STI CMP 특성 연구

  • Jung, Jae-Woo (Department of Precision and Mechanical Engineering, Pusan National University) ;
  • Park, Ki-Hyun (Department of Precision and Mechanical Engineering, Pusan National University) ;
  • Jang, One-Moon (Department of Precision and Mechanical Engineering, Pusan National University) ;
  • Park, Sun-Joon (Department of Precision and Mechanical Engineering, Pusan National University) ;
  • Jeong, Moon-Ki (Department of Precision and Mechanical Engineering, Pusan National University) ;
  • Jeong, Hae-Do (Department of Precision and Mechanical Engineering, Pusan National University)
  • 정재우 (부산대학교 정밀기계공학과) ;
  • 박기현 (부산대학교 정밀기계공학과) ;
  • 장원문 (부산대학교 정밀기계공학과) ;
  • 박선준 (부산대학교 정밀기계공학과) ;
  • 정문기 (부산대학교 정밀기계공학과) ;
  • 정해도 (부산대학교 정밀기계공학과)
  • Published : 2005.11.10
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Abstract

Chemical mechanical polishing (CMP) allows the planarization of wafers with two or more materials at their surfaces. Especially, polishing pad is considered as one of the most important consumables because of its properties. Subject of this investigation is to apply CMP for planarization of shallow trench isolation structure using microstructure pad. Microstructure pad is designed to have uniform structure on its surface and fabricated by micro-molding technology. And then STI CMP performances such as oxide dishing and nitride corner rounding are evaluated.

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