Rectangular Microlens array for Multi Chip LED Packaing

LED 패키지를 위한 사각 형상의 마이크로 렌즈

  • Lim C.H. (Samsung Electro-Mechanics Co., LTD) ;
  • Jeung W.K. (Samsung Electro-Mechanics Co., LTD) ;
  • Choi S.M. (Samsung Electro-Mechanics Co., LTD) ;
  • Oh Y.S. (Samsung Electro-Mechanics Co., LTD)
  • Published : 2005.10.01

Abstract

A new rectangular shape microlens array having high sag for solid-state lighting is presented. Proposed microlens, which has high sag, over $375{\mu}m$ and large diameter, over 3 mm can enormously enhance output optical extraction efficiency. Rectangular shape of microlens can maximize the fill factor of light-emitting-diode (LED) package and minimize the optical loss at the same time. This wafer level microlens array is fabricated on LED package. It has many advantages in optical properties, low cost, high aligning accuracy, and mass production.

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