Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2005.07a
- /
- Pages.170-171
- /
- 2005
Analyzing the characteristics of Thermal Transient on MOSFET depending on Heat Sink surface area
히트싱크 크기에 따른 MOSFET의 열전달 특성변화 분석
-
Kim, Ki-Hyun
(KERI)
;
-
Seo, Kil-Soo
(KERI)
;
-
Kim, Hyoung-Woo
(KERI)
;
-
Kim, Sang-Choel
(KERI)
;
- Bahng, Wook (KERI) ;
-
Kang, In-Ho
(KERI)
- Published : 2005.07.07
Abstract
Generally when Power MOSFET is operated, a heat sink is attached to it to emit heat caused by the operation. As the surface area of a heat sink is smaller, the thermal impedance is larger, which causes a negative influence on the characteristics of the chips and the devices and shortens the lifespan of them. In this experiment, we've compared and analysed different effects of heat sinks with 5 different surface areas on the characteristics of Thermal Transient when they are applied respectively.