한국전기전자재료학회:학술대회논문집 (Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference)
- 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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- Pages.170-171
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- 2005
히트싱크 크기에 따른 MOSFET의 열전달 특성변화 분석
Analyzing the characteristics of Thermal Transient on MOSFET depending on Heat Sink surface area
- Kim, Ki-Hyun (KERI) ;
- Seo, Kil-Soo (KERI) ;
- Kim, Hyoung-Woo (KERI) ;
- Kim, Sang-Choel (KERI) ;
- Bahng, Wook (KERI) ;
- Kang, In-Ho (KERI)
- 발행 : 2005.07.07
초록
Generally when Power MOSFET is operated, a heat sink is attached to it to emit heat caused by the operation. As the surface area of a heat sink is smaller, the thermal impedance is larger, which causes a negative influence on the characteristics of the chips and the devices and shortens the lifespan of them. In this experiment, we've compared and analysed different effects of heat sinks with 5 different surface areas on the characteristics of Thermal Transient when they are applied respectively.