Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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Evaluation of Chemical Mechanical Polishing Performances with Microstructure Pad

마이크로 표면 구조를 가지는 CMP 패드의 연마 특성 평가

  • Jung, Jae-Woo (Depart of Mechanical and Precision Engineering, Pusan National University) ;
  • Park, Ki-Hyun (Depart of Mechanical and Precision Engineering, Pusan National University) ;
  • Chang, One-Moon (Depart of Mechanical and Precision Engineering, Pusan National University) ;
  • Park, Sung-Min (Depart of Mechanical and Precision Engineering, Pusan National University) ;
  • Jeong, Seok-Hoon (Depart of Mechanical and Precision Engineering, Pusan National University) ;
  • Lee, Hyun-Seop (Depart of Mechanical and Precision Engineering, Pusan National University) ;
  • Jeong, Hae-Do (School of Mechanical Engineering, Pusan National University)
  • 정재우 (부산대학교 정밀기계공학과) ;
  • 박기현 (부산대학교 정밀기계공학과) ;
  • 장원문 (부산대학교 정밀기계공학과) ;
  • 박성민 (부산대학교 정밀기계공학과) ;
  • 정석훈 (부산대학교 정밀기계공학과) ;
  • 이현섭 (부산대학교 정밀기계공학과) ;
  • 정해도 (부산대학교 기계공학부)
  • Published : 2005.07.07
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Abstract

Chemical mechanical polishing (CMP) has emerged as the planarization technique of choice in integrated circuit manufacturing. Especially, polishing pad is considered as one of the most important consumables because of its properties. Generally, conventional polishing pad has irregular pores and asperities. If conditioning process is except from whole polishing process, smoothing of asperities and pore glazing occur on the surface of the pad, so repeatability of polishing performances cannot be expected. In this paper, CMP pad with microstructure was made using micro-molding technology and repeatability of ILD(interlayer dielectric) CMP performances and was evaluated.

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