Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2005.07a
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- Pages.655-656
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- 2005
Fabrication of metal line on plastic substrate by hot embossing and CMP process
핫 엠보싱 공정과 CMP 공정을 이용한 플라스틱 기판에 메탈 라인 형성
- Cha, Nam-Goo (Micro Biochip Center, Hanyang Univ.) ;
- Kang, Young-Jae (Micro Biochip Center, Hanyang Univ.) ;
- Park, Chang-Hwa (Micro Biochip Center, Hanyang Univ.) ;
- Rim, Hyung-Woo (Micro Biochip Center, Hanyang Univ.) ;
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Park, Jin-Goo
(Micro Biochip Center, Hanyang Univ.)
- 차남구 (한양대학교 마이크로바이오칩센터) ;
- 강영재 (한양대학교 마이크로바이오칩센터) ;
- 박창화 (한양대학교 마이크로바이오칩센터) ;
- 임현우 (한양대학교 마이크로바이오칩센터) ;
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박진구
(한양대학교 마이크로바이오칩센터)
- Published : 2005.07.07
Abstract
In the future, plastic based system will play a crucial role in modem life, for examples, transparent display or disposable electronics and so on. In this paper, we introduced a new method to fabricate the metal line on the plastic substrate. Metal lines were fabricated by hot embossing and CMP process on PMMA (polymethylmethacrylate) substrates. A Si mold was made by wet etching process and a PMMA wafer was cut off from I mm thick PMMA sheet. A 100 nm thick Al was deposited on PMMA wafers. The Al deposited PMMA wafer and the Si mold carefully sandwiched which was directly imprinted by hot embossing. After imprinting process, a residual Al layer was removed by CMP process. Finally, we found the entire process may be very useful to fabricate the metal line on plastic substrates.