Enhanced Interfacial Adhesion between Polymers and Metals(Cu) by Low Energy Ion-beam Irradiation with Reactive Gases

반응성 기체를 첨가한 저 에너지 이온빔 처리에 의한 고분자와 금속 간의 계면 접착력 증가에 관한 연구

Using a low-energy Ar+ ion-beam with and without reactive gases, polymers such as chemically stable poly(ether ether ketone) (PTFE) and poly(ether ether ketone) (PEEK) films were modified to have special surface features. The adhesion strength between the polymers and the copper was significantly improved because of both changes in the surface topography and chemical interactions due to polymer surface functionalization (oxidation and amination). The surface modification altered the failure mode from adhesive failure for the unmodified polymer/Cu interface to cohesive failure for the surface-modified polymer/Cu layer interface..