Proceedings of the Korean Institute of Surface Engineering Conference (한국표면공학회:학술대회논문집)
- 2005.11a
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- Pages.125-125
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- 2005
Surface Defects of Sputter Type 2 Layer Flexible Copper Clad Laminate for Electronic Circuit
전자 회로 소재용 Sputtering 방식 2층 동적층판(Flexible Copper Clad Laminate)의 표면 결함 및 원인
- Published : 2005.11.04
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