Proceedings of the Materials Research Society of Korea Conference (한국재료학회:학술대회논문집)
- 2005.05a
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- Pages.120-120
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- 2005
The effect of atmospheric pressure dielectric barrier diacharge on the adhesion of polyimide and copper
대기압 배리어 방전의 polyimide/Cu 접합 특성에 미치는 영향
- Published : 2005.05.26
Abstract
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