Fabrication and Strength Properties of LPS-SiC based materials

  • Lee, Sang-Pill (Department of Mechanical engineering, Dongeui University) ;
  • Kohyama, Akira (Institute of Advanced Energy, Kyoto University)
  • Published : 2006.11.16

Abstract

This paper dealt with the LPS process for the development of high performance SiC materials, based on the detailed analysis of their microstructure and mechanical properties. The submicron SiC powder was used for the fabrication of LPS-SiC materials. A mixture of $Al_2O_3$ and $Y_2O_3$ particles was also used as a sintering additive in the LPS process. LPS-SiC materials were fabricated at different temperatures, using various additive composition ratio ($Al_2O_3/Y_2O_3$). The total amount of additive materials ($Al_2O_3+Y_2O_3$) was fixed as 10 wt%. The characterization Of LPS-SiC materials was investigated by means of SEM, XRD and three point bending test. The LPS-SiC material represented a relative density of about 98 % and a flexural strength of about 800MPa, when it was fabricated at the temperature of $1820^{\circ}C$ and the additive compositional ratio of 1.5.

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