Advanced Permeation Properties of Solvent-free Multi-Layer Encapsulation of thin films on Ethylene Terephthalate(PET)

  • Han, Jin-Woo (Department of Electrical and Electronics Engineering, Yonsei University) ;
  • Kang, Hee-Jin (Department of Electrical and Electronics Engineering, Yonsei University) ;
  • Kim, Jong-Yeon (Department of Electrical and Electronics Engineering, Yonsei University) ;
  • Kim, Jong-Hwan (Department of Electrical and Electronics Engineering, Yonsei University) ;
  • Han, Jung-Min (Department of Electrical and Electronics Engineering, Yonsei University) ;
  • Moon, Hyun-Chan (NANO mechatronics Research Center, Korea Electronics Technology Institute) ;
  • Park, Kwang-Bum (NANO mechatronics Research Center, Korea Electronics Technology Institute) ;
  • Kim, Hwi-Woon (Bang Joo Opical Co., Ltd.) ;
  • Seo, Dae-Shik (Department of Electrical and Electronics Engineering, Yonsei University)
  • Published : 2006.08.22

Abstract

In this paper, the inorganic multi-layer encapsulation of thin film was newly adopted to protect the organic layer from moisture and oxygen. Using the electron beam, Sputter, inorganic multi-layer thin-film encapsulation was deposited onto the Ethylene Terephthalate(PET) and their interface properties between inorganic and organic layer were investigated. In this investigation, the SiON $SiO_2$ and parylene layer showed the most suitable properties. Under these conditions, the water vapor transmission rate (WVTR) for PET can be reduced from level of $0.57g/m^2/day$ (bare substrate) to $1^{\ast}10^{-5}g/m^2/day$ after application of a SiON and $SiO_2$ layer. These results indicate that the $PET/SiO_2/SiON/Parylene$ barrier coatings have high potential for flexible organic light-emitting diode(OLED) applications.

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