Proceedings of the KWS Conference (대한용접접합학회:학술대회논문집)

The Korean Welding and Joining Society (대한용접접합학회)
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The study of Copper foil surface treatment for Flexible Copper Clad Laminate (FCCL)

플렉시블 동장적층판 개발을 위한 동박표면처리에 관한 연구

  • 문원철 (성균관대학교/패키징사업단) ;
  • 이창용 (성균관대학교/신소재공학부) ;
  • 이재홍 (성균관대학교/신소재공학부) ;
  • 정승부 (성균관대학교/신소재공학부)
  • Published : 2006.05.01
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Abstract

The copper foil of 10fm of thickness was prepared, and the surface treatment on the copper foil was done by the method of the electrolytic plating in the acid solution with the sulfate ion as a purpose to remove the main element of the surface contaminant of copper variously. The structure on the surface of the copper foil in this study investigated AFM with SEM the changed phenomenon according to added plating time and current. The phenomenon of the structure's of the oxide on the surface of long plating time and high current growing was confirmed.

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