Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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Manufacture and Characteristic of Surface Mounted Device Type Fast Recovery Diode with Ceramic Package

세라믹 패키지를 이용한 표면 실장형 다이오드의 제작과 특성 평가

  • Chun, Myoung-Pyo (Advenced Materials and Components Lab, Korea Institute of Ceramic Engineering and Technology) ;
  • Cho, Sang-Hyeok (Advenced Materials and Components Lab, Korea Institute of Ceramic Engineering and Technology) ;
  • Cho, Jeong-Ho (Advenced Materials and Components Lab, Korea Institute of Ceramic Engineering and Technology) ;
  • Kim, Byung-Ik (Advenced Materials and Components Lab, Korea Institute of Ceramic Engineering and Technology) ;
  • Yu, In-Ki (Cob-Technology Co., LTd.)
  • Published : 2006.11.09
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Abstract

The SMD type P-N junction diode with ceramic package for diode case were fabricated. It was made this diode with simple process from $Al_2O_3$ ceramic chip, solder preform, diode chip, coating reagent and conductive paste for chip terrmination. Its merit is small size, easy manufacture. fast cooling with ceramic case. The electric characteristics of the diode such as reverse recovery time, breakdown voltage, forward voltage, and leakage current were 5 28ns, 1322V, 1.08V, $0.45{\mu}A$.

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