Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2006.11a
- /
- Pages.300-301
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- 2006
Investigation for glass warpage in the COG process
COG 압착 공정에서의 Glass 휨 연구
- Kim, Byoung-Yong (Yonsei Univ.) ;
- Kim, Jong-Hwan (Yonsei Univ.) ;
-
Choi, Sung-Ho
(Yonsei Univ.)
;
-
Oh, Yong-Cheul
(Kwangwoon Univ.)
;
-
Seo, Dae-Shik
(Yonsei Univ.)
- Published : 2006.11.09
Abstract
We studied about new module technology to solve warpage problems that produce bending of cell in the LCD (Liquid crystal display). Characteristics of cell gap and glass bending of applying heat Panel's PAD part and cell at various temperature was investigated. When applies heat and compresses PAD party only in case of compressing COG(Chip on Glass), uniformity of cell gap that happen by glass bending by temperature of these compressing COG In the PAD party is decreased. However, in case of compress COG. glass bending of applying heat Panel's PAD part and cell at various temperature produced 20um. But, uniformity of cell gap was not decreased. Therefore, it is considered that applying heat Panel's PAD part and cell could decrease uniformity of cell gap and bending of glass.