Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2006.06a
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- Pages.49-50
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- 2006
Mechanical Analysis on Uniformity in Copper Chemical Mechanical Planarization
Copper CMP시 연마균일성에 관한 기계적 해석
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Jeong, Hae-Do
(School of Mechanical Engineering in PNU)
;
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Lee, Hyun-Seop
(Department of Precision & Mechanical Engineering in PNU)
;
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Kim, Hyoung-Jae
(G&P Technology)
- Published : 2006.06.22
Abstract
The studies on Cu CMP have focused on material removal and its mechanisms. Although many studies have been conducted on the mechanism of Cu CMP, a study on uniformity in Cu CMP is still unknown. Since the aim of CMP is global and local planarization, the approach to uniformity in Cu CMP is essential to elucidate the Cu CMP mechanism as well. The main purpose of the experiment reported here was to investigate the roles of slurry components in the formation of the uniformity in Cu CMP. All the results of in this study showed that the uniformity in Cu CMP could be controlled by the contents of slurry components.