Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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Modeling of the Conditioning Process in Chemical Mechanical Polishing

컨디셔닝 공정의 수학적 모델링

  • Chang, One-Moon (Department of Precision and Mechanical Engineering, Pusan National University) ;
  • Park, Ki-Hyun (Department of Precision and Mechanical Engineering, Pusan National University) ;
  • Lee, Hyun-Seop (Department of Precision and Mechanical Engineering, Pusan National University) ;
  • Jung, Won-Duck (Department of Precision and Mechanical Engineering, Pusan National University) ;
  • Park, Sung-Min (Department of Precision and Mechanical Engineering, Pusan National University) ;
  • Park, Boum-Young (Department of Precision and Mechanical Engineering, Pusan National University) ;
  • Seo, Heon-Deok (Department of Precision and Mechanical Engineering, Pusan National University) ;
  • Kim, Hyoung-Jea (G&P Technology Co.) ;
  • Jeong, Hae-Do (School of Mechanical Engineering, Pusan National University)
  • Published : 2006.06.22
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Abstract

The conditioning process is very important process for the CMP (Chemical Mechaning Polishing). This process regenerates the roughness of the polishing pad during the CMP process, increases the MRR (Material Removal Rate) and gives us longer pad life so conditioning process is essential for the CMP, and conditioning process influences the polishing pad shape gradually. Conditining process is related to the Non-Uniformity. In This paper, Kinematic of the conditioning process and mathematic modeling of the pad wear is studied and result shows how the various parameters influence the pad shape and WIWNU[1]. Consequently through these parameter, optimal design of the conditioning process equipment is predicted.

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