Proceedings of the Korean Society of Precision Engineering Conference (한국정밀공학회:학술대회논문집)

  • 2006.05a
  • /
  • Pages.143-144
  • /
  • 2006
  • /
  • 2005-8446(pISSN)
Korean Society for Precision Engineering (한국정밀공학회)
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Fabrication of the multi-layer structure and Nickel mold with electroforming using KMPR

KMPR을 이용한 다층구조물 제작 및 전해도금을 이용한 니켈몰드 제작

  • 황성진 (부산대학교 기계공학부) ;
  • 정필구 (부산대학교 기계공학부) ;
  • 고정상 (부산대학교 기계공학부) ;
  • 고종수 (부산대학교 기계공학부) ;
  • 정임덕 (부산대학교 미세기계전자시스템 협동과정) ;
  • 김인곤 (동의대학교 신소재공학과)
  • Published : 2006.05.01
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Abstract

In this paper, we proposed XP KMPR-1050 negative tone resist to replace SU-8 resist for multi-layer micro-structures and thick plating mold fabrication using UV-LIGA process. XP KMPR resist proposed in this paper can be easily striped using a common stripping solution such as NMP without damage of micro-structure. The conditions for the fabrication of XP KMPR micro-structure were optimized by adjustment of exposure and post-exposure bake(PEB). The $140{\mu}m$ -thick and an aspect ratio at least 10 micro-structure and multi-layer structures were successfully fabricated through the process conditions. Through-mold electroplating and PR striping of XP KMPR has been successfully demonstrated.

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