Effects of Metallic Cu/Ag Precoating Layers on the Contact Properties Between In-Bi Solder and $Bi_{2212}$

  • Jang, J.H. (Korea University of Technology and Education) ;
  • Kim, C.J. (Korea Atomic Energy Research Institute) ;
  • Hyun, O.B. (Korea Electric Power Research Institute) ;
  • Park, H.W. (Korea University of Technology and Education)
  • 발행 : 2006.08.16