Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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A Study on Pad Profile Variation Using Kinematical Analysis on Swing Ann Conditioner

스윙 암 컨디셔너의 기구학적 해석을 통한 CMP 패드 프로파일 변화에 관한 연구

  • Oh, Ji-Heon (Precision Manufacturing System Div., Graduate School of Mechanical Engineering, Pusan National Univ.) ;
  • Kim, Yong-Min (Precision Manufacturing System Div., Graduate School of Mechanical Engineering, Pusan National Univ.) ;
  • Lee, Ho-Jun (Precision Manufacturing System Div., Graduate School of Mechanical Engineering, Pusan National Univ.) ;
  • Lee, Sang-Jik (Precision Manufacturing System Div., Graduate School of Mechanical Engineering, Pusan National Univ.) ;
  • Kim, Hyoung-Jae (Korea Institute of Industrial Technology) ;
  • Jeong, Hae-Do (Precision Manufacturing System Div., Graduate School of Mechanical Engineering, Pusan National Univ.)
  • 오지헌 (부산대학교 대학원 기계공학부 정밀가공시스템) ;
  • 김영민 (부산대학교 대학원 기계공학부 정밀가공시스템) ;
  • 이호준 (부산대학교 대학원 기계공학부 정밀가공시스템) ;
  • 이상직 (부산대학교 대학원 기계공학부 정밀가공시스템) ;
  • 김형재 (한국생산기술연구소) ;
  • 정해도 (부산대학교 대학원 기계공학부 정밀가공시스템)
  • Published : 2007.11.01
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Abstract

A CMP Process has many factors that affect result of a polished wafer. Dominant factors are velocity, pressure and temperature in process. A pad profile is also considered as affecting factor of CMP. Accoding to variation of a pad profile, the each pan of a wafer is differently pressured. It appears to affect the uniformity of a wafer. A pad profile varies as a swing arm conditioner which have been ordinarily used in industry. A swing arm conditioner has several sectors in its swing path. This study aims that a wafer get a good uniformity as swing arm conditioner's path on pad is analyzed and simulated. Through the simulation, tendency of pad profile after conditioning will be predicted and the result of simulation compared with the result of experiment. The optimized pad profile would be made by to vary swing arm's velocity on each sector. In order to maintain the optimized profile, conditioner design or swing arm's velocity should be changed and designed.

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