CMP process monitoring system using AE sensor

AE를 이용한 CMP 공정 감시에 관한 연구

  • Park, Sun-Joon (Precision Manufacturing System Div., Graduate School of Mechanical Engineering, Pusan National Univ.) ;
  • Kim, Sung-Ryul (Precision Manufacturing System Div., Graduate School of Mechanical Engineering, Pusan National Univ.) ;
  • Park, Boum-Young (Precision Manufacturing System Div., Graduate School of Mechanical Engineering, Pusan National Univ.) ;
  • Lee, Hyun-Seop (Precision Manufacturing System Div., Graduate School of Mechanical Engineering, Pusan National Univ.) ;
  • Jeong, Hea-Do (Precision Manufacturing System Div., Graduate School of Mechanical Engineering, Pusan National Univ.)
  • 박선준 (부산대학교 대학원 기계공학부 정밀가공시스템) ;
  • 김성렬 (부산대학교 대학원 기계공학부 정밀가공시스템) ;
  • 박범영 (부산대학교 대학원 기계공학부 정밀가공시스템) ;
  • 이현섭 (부산대학교 대학원 기계공학부 정밀가공시스템) ;
  • 정해도 (부산대학교 대학원 기계공학부 정밀가공시스템)
  • Published : 2007.11.01

Abstract

This paper compared wired Acoustic Emission (AE) signals with wireless AE signals. According to the material and process condition, each process signal has distinguishable characteristic to show each removal phenomenon. Therefore, wired and wireless AE sensors having different bandwidth are complementary for CMP process monitoring. Especially, the AE sensor was used to investigate abrasive and molecular-scale phenomena during CMP process, which was compatible to acquire high level frequency. In experiment, wireless AE system was used to get signals in rotary system, using bluetooth. But, it is possible to acquire only RMS signals, which can not analyze abrasive and molecular-sale phenomena. Second, wired AE system was installed using mercury slip-ring, which is suitable not only for rotation equipment but also for acquiring original signals. The acquired signals were analyzed by FFT for understanding of abrasive and molecular revel phenomena in CMP process, finally, we verified that two types of AE sensor with different bandwidth were complementary for CMP process monitoring.

Keywords