Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2007.06a
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- Pages.555-556
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- 2007
Effect of Sliding Distance and Temperature on Material Non-uniformity in Oxide CMP
Oxide CMP에서 Sliding Distance와 온도가 재료제거와 연마 불균일도에 주는 영향
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Kim, Young-Jin
(Precision Manufacturing System Div., Pusan National Univ.)
;
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Park, Boum-Young
(Mechanical Engineering Dept., Pusan National Univ.)
;
- Cho, Han-Chul (Precision Manufacturing System Div., Pusan National Univ.) ;
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Jeong, Hae-Do
(Mechanical Engineering Dept., Pusan National Univ.)
- Published : 2007.06.21
Abstract
Through the single head kinematics, sliding distance is a movement of a pad within wafer. The sliding distance is very important to frictional heat, material removal, and so on. A Temperature distribution is similar to sliding distance. But is not same. Because of complex process factor in CMP. A platen velocity is a dominant factor in a temperature and material removal. WIWNU is low in head faster condition.