Fabrication of High Aspect Ratio Micro Structure for fine pitch probe production

Fine pitch probe 제작을 위한 고세장비 마이크로 구조물 제작

  • 이상일 ((주)새한마이크로텍 기술연구소) ;
  • 김웅겸 ((주)새한마이크로텍 기술연구소) ;
  • 표창률 ((주)새한마이크로텍 기술연구소) ;
  • 김대용 ((주)새한마이크로텍 기술연구소) ;
  • 양승진 ((주)새한마이크로텍 기술연구소) ;
  • 고귀현 ((주)새한마이크로텍 기술연구소) ;
  • 김학준 ((주)새한마이크로텍 기술연구소) ;
  • 전병희 (인덕대학 기계공학부)
  • Published : 2007.10.11

Abstract

Continuing improvements in integrated circuit chip density and functionality have mostly contributed toward a very large-scale integrated circuit(VLSI) and display device. In order to test (pass or fail) all of the high integrated semiconductor chip and display device, fine pitch probes are used. Fine pitch probes are manufactured by electroforming process of a Ni alloy in an electrolytic bath. In this paper, we expect that the electric field in bath with the Finite Element Method and applying the FEM result. So, we can obtained the probes that have high aspect ratio of 10 : 1

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