Development of High Precision Mold for Narrow Pitch BGA Test Socket -Reduction Technology of Warpage using CAE and Statistical Techniques
협피치 BGA Test Socket용 고정밀 금형기술 개발(2) - 성형해석 및 통계적 기법을 활용한 변형저감 기술
- Jung, Woo-Chul (Precision Molds & Dies Team, KITECH) ;
-
Heo, Young-Moo
(Precision Molds & Dies Team, KITECH)
;
-
Shin, Kwang-Ho
(Precision Molds & Dies Team, KITECH)
;
-
Chang, Sung-Ho
(Precision Molds & Dies Team, KITECH)
;
-
Jung, Tae-Sung
(JY-Solutec)
- 정우철 (한국생산기술연구원 정밀금형팀) ;
-
허영무
(한국생산기술연구원 정밀금형팀)
;
-
신광호
(한국생산기술연구원 정밀금형팀)
;
-
장성호
(한국생산기술연구원 정밀금형팀)
;
-
정태성
(재영솔루텍)
- Published : 2008.06.24
Abstract
The technologies of mold design, manufacturing, injection molding process and computer aided engineering(CAE) are developed rapidly with the growth of plastic product market. Injection molding process optimum design can not be easily determined. This study was determined factors and levels which carried out to analyze an influence of narrow pitch BGA socket warpage and performed investigating the main effect and interaction effect between factors using design of experiment. The result of this paper is injection time and packing pressure are affect on narrow pitch BGA socket warpage at injection molding.