Cu-based ink-jet printable inks for highly conductive patterns at lower temperature

  • Woo, Kyoo-Hee (Dept. of Materials Science and Engineering, Yonsei University) ;
  • Kim, Dong-Jo (Dept. of Materials Science and Engineering, Yonsei University) ;
  • Moon, Joo-Ho (Dept. of Materials Science and Engineering, Yonsei University)
  • Published : 2008.10.13

Abstract

The metal films ink-jetted using the conductive ink based on a mixture of copper and silver nanoparticles were investigated. The porosity and resistivity of films were minimized by adjusting the mixing ratio of Cu and Ag nanoparticles. We demonstrated that the printed tracks with good conductivity could be obtained at sufficiently lower annealing temperatures where plastic substrates could be used.

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