Direct Fabrication of a-Si:H Thin Film Transistor Arrays on Flexible Substrates: Critical Challenges and Enabling Solutions

  • O'Rourke, Shawn M. (Flexible Display Center at Arizona State University) ;
  • Loy, Douglas E. (Flexible Display Center at Arizona State University) ;
  • Moyer, Curt (Flexible Display Center at Arizona State University) ;
  • Bawolek, Edward J. (Flexible Display Center at Arizona State University) ;
  • Ageno, Scott K. (Flexible Display Center at Arizona State University) ;
  • O'Brien, Barry P. (Flexible Display Center at Arizona State University) ;
  • Marrs, Michael (Flexible Display Center at Arizona State University) ;
  • Bottesch, Dirk (Flexible Display Center at Arizona State University) ;
  • Dailey, Jeff (Flexible Display Center at Arizona State University) ;
  • Naujokaitis, Rob (Flexible Display Center at Arizona State University) ;
  • Kaminski, Jann P. (Flexible Display Center at Arizona State University) ;
  • Allee, David R. (Flexible Display Center at Arizona State University) ;
  • Venugopal, Sameer M. (Flexible Display Center at Arizona State University) ;
  • Haq, Jesmin (Flexible Display Center at Arizona State University) ;
  • Colaneri, Nicholas (Flexible Display Center at Arizona State University) ;
  • Raupp, Gregory B. (Flexible Display Center at Arizona State University)
  • Published : 2008.10.13

Abstract

In this paper we describe solutions to address critical challenges in direct fabrication of amorphous silicon thin film transistor (TFTs) arrays for active matrix flexible displays. For all flexible substrates a manufacturable handling protocol in automated display-scale equipment is required. For metal foil substrates the principal challenges are planarization and electrical isolation, and management of stress (CTE mismatch) during TFT fabrication. For plastic substrates the principal challenge is dimensional instability management.

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