Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2008.06a
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- Pages.10-10
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- 2008
Copper Pillar-Tin Bump with Immersion Tin Plating for High-Density Flip Chip Packaging
무전해 주석도금을 이용한 구리기둥-주석범프의 형성과 고밀도 플립칩 패키지 제조방법
- Cho, Il-Hwan (MyongJi Univ.) ;
- Hong, Se-Hwan (MyongJi Univ.) ;
- Jeong, Won-Cheol (MyongJi Univ.) ;
- Ju, Gyeong-Wan (MyongJi Univ.) ;
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Hong, Sang-Jeen
(MyongJi Univ.)
- Published : 2008.06.19
Abstract
Flip chip technology is keeping pace with the increasing connection density of the ICs and is capable of transferring semiconductor performance to the printed circuit board. One of the most general flip chip technology is CPB technology presented by Intel. The CPTB technology has similar benefits with CPB but has simpler process and better reliability characteristics. In this paper, process sequence and structure of CPTB are presented.