한국정보디스플레이학회:학술대회논문집
- 2009.10a
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- Pages.1479-1482
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- 2009
Study on vertical wet etching of aluminum metal film for TFT application
- Lee, Sang-Hyuk (Dept. of Materials Engineering, Korea Aerospace University) ;
- Seo, Bo-Hyun (Dept. of Materials Engineering, Korea Aerospace University) ;
- Lee, In-Kyu (Dept. of Materials Engineering, Korea Aerospace University) ;
- Seo, Jong-Hyun (Dept. of Materials Engineering, Korea Aerospace University) ;
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Lee, Kang-Woong
(School. of Electronic Engineering, Korea Aerospace University)
;
- Jeon, Jae-Hong (School. of Electronic Engineering, Korea Aerospace University) ;
- Choe, Hee-Hwan (School. of Electronic Engineering, Korea Aerospace University) ;
- Ryu, Jong-Hyeok (KW-Tech, Rm907, Byucksan Technopia) ;
- Park, Byung-Woo (FNS Tech) ;
- Chang, Dae-Hyun (FNS Tech)
- Published : 2009.10.12
Abstract
Compared with tilt transfer wet station, vertical etching system has a variety of advantages that are 50% space savings, higher throughput, fairly good etch uniformity over an entire glass for thin film transistor application. The aim of the present work is to study on a vertical etching system to improve the process factors. The computational fluid dynamics analysis is used to demonstrate the change of the etch uniformity as a function of tilt angle of the glass substrate.